Ferroelectric memory GX85RS2MC wafer encapsulated MCU, meeting the requirements of small size and high performance
Time:2024-12-23
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Encapsulation chip is a technology that integrates multiple chips and electronic components into one package. It achieves higher integration and smaller size by stacking multiple chips. For example, in the ferroelectric memory GX85RS2MC encapsulated MCU, it can significantly reduce the power consumption of electronic devices, improve performance, simplify design, and enhance chip performance because multiple chips can process data in parallel, thereby accelerating processing speed. It has the following advantages:
1. Reduce size: Reduce the volume of the entire system.
2. Improve performance: Reduce signal transmission delay and enhance overall performance.
3. Cost reduction: Reduce packaging materials and process costs.
4. Enhance reliability: reduce failure rate.
5. Simplify circuit design: facilitate system integration.
The core technology of GXSC GX85RS2MC ferroelectric memory is the formation of non-volatile storage units using ferroelectric process and silicon gate CMOS process technology, which can maintain data without the need for batteries. Due to its ability to simultaneously have RAM and ROM performance, it is currently considered a possible future super memory to replace various types of storage devices.

Compared with EEPROM, GX85RS2MC has the advantages of fast read and write speed (up to 1 million times), long write life, and low write energy consumption. Its working voltage range is 2.7V to 3.6V, with a minimum standby power consumption of only 9 microamperes. It can instantly save data at low currents, ensuring information security in the system. Its applications include smartphones, tablets, computers, IoT devices, etc.
The application parameters of GX85RS2MC are as follows:
• Capacity: 2M;
Interface type: SPI interface;
• Operating frequency: 25 MHz;
Data retention: 10 years @ 85 ℃ (200 years @ 25 ℃);
• High speed read feature: Supports 40MHz high-speed read commands;
• Working environment temperature range: -40 ℃ to 85 ℃;
• Packaging form: 8-pin SOP packaging, compliant with RoHS;
• Performance compatible with MB85RS2MT (Fujitsu) and FM25V20A (Cypress);