Ferroelectric Memory GX85RS2MC Wafer Hopper MCUs for Small Form Factor and High Performance

Hopper chip is a technology that integrates multiple chips and electronic components into a single package. It achieves higher integration and smaller size by stacking multiple chips on top of each other. For example, ferroelectric memory GX85RS2MC in a Hopper MCU can significantly reduce power consumption, improve performance and simplify the design of electronic devices, and enhance the performance of the chip because multiple chips can process data in parallel, thus speeding up processing. It has some of the following advantages:

1. size reduction: reduces the size of the entire system.

2. Improved performance: Reduces signaling delays and improves overall performance.

3. Reduced cost: Reduce the cost of packaging materials and processes. 4.

4. Enhanced Reliability: Reduced failure rate.

5. Simplified circuit design: facilitates system integration.

The core technology of GXSC GX85RS2MC ferroelectric memory is the ferroelectric process and silicon gate CMOS process technology to form a non-volatile memory cell, which does not require a battery to maintain data. Because the memory can be both RAM and ROM performance, it is currently considered that the future may be a super memory to replace various types of memory devices.

Compared with EEPROM, GX85RS2MC has the advantages of fast read/write speed (up to 1 million times), long write life, and low write power consumption. With an operating voltage range of 2.7V to 3.6V and a minimum standby power consumption of only 9 microamps, it is able to instantly save data at low currents, ensuring information security in the system. Its applications include smartphones, tablets, computers, IoT devices, and more.